SK Hynix Completes Deal for $958 Million in US Chips Grant, Loan

SK Hynix Completes Deal for $958 Million in US Chips Grant, Loan




The Biden administration has cemented a deal to give SK Hynix Inc. as much as $458 million in grants and $500 million in loans to support an advanced chip packaging facility in Indiana, a key part of US efforts to build a domestic semiconductor supply chain.



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