Chiplet Standard Goes 3D

Inference using OpenELM Models


The standards governing chiplet technology now have a second iteration.

The Universal Chiplet Interconnect Express (UCIe) Consortium, which was formed in March 2022, recently released its 2.0 specification



Source link
lol

By stp2y

Leave a Reply

Your email address will not be published. Required fields are marked *

No widgets found. Go to Widget page and add the widget in Offcanvas Sidebar Widget Area.